河内分分彩

BIWIN eMCP

eMCP

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产品规格
Interface eMMC+LPDDR4X
Dimension 11.5x13x1.0mm/11.5x13x1.2mm
Max. Sequential Read
Max. Sequential Write
Density 32GB+32Gb/64GB+32Gb
Approved verification platform Spreadtrum:7731E;9832E;9820E;SC9850K;SC7731C;SC7731G;SC8825; SC9820;SC9832;SC9832A;SC9832E;SC9850;SC9853;SC9863A
Qualcomm:8909;APQ8009W;MSM8909W
MediaTek:MT6580; MT6735; MT6737; MT6739;MT6761;MT6570;MT6570N;MT6572;MT6735;M6735M;MT6737T;MT6753;MT67
Operating voltage eMMC:1.2V, 1.8V and 3.3V
Low power DDR4/4X:VDD1=1.8V; VDD2=VDDCA=VDDQ=1.2V VDD1=1.8V; VDD2=1.1V; VDDQ=1.1V or 0.6V
Operating temperature -20℃~85℃
Packaging FBGA254
应用方向 车载电子 / 智能穿戴 / 教育电子 / 平板 / 智能手机 / 游戏娱乐
选型信息

32GB+32Gb

BWCC2KD6-32G

 

64GB+32Gb

BWCC2KD6-64G