河内分分彩

 TSOPFENGZHUANGWAIXINGCHICUNSHI,JISHENGCANSHU(DIANLIUDAFUDUBIANHUASHI,YINQISHUCHUDIANYARAODONG) JIANXIAO,SHIHEGAOPINYINGYONG,CAOZUOBIJIAOFANGBIAN,KEKAOXINGYEBIJIAOGAO。TONGSHITSOPFENGZHUANGJUYOUCHENGPINLVGAO,JIAGEBIANYIDENGYOUDIAN,YINCIDEDAOLEJIWEIGUANGFANDEYINGYONG。SHANGSHIJI80NIANDAI,XINPIANDETSOPFENGZHUANGJISHUCHUXIAN,DEDAOLEYEJIEGUANGFANDERENKE。TSOPFENGZHUANGYOUYIGEFEICHANGMINGXIANDETEDIAN,JIUSHICHENGPINCHENGXITIAOZHUANGZHANGKUANBIYUEWEI2:1,ERQIEZHIYOULIANGMIANYOUJIAO,SHIHEYONGSMTJISHU(BIAOMIANANZHUANGJISHU)ZAIPCB(YINZHIDIANLUBAN)SHANGANZHUANGBUXIAN。TSOPFENGZHUANGWAIXINGCHICUNSHI,JISHENGCANSHU(DIANLIUDAFUDUBIANHUASHI,YINQISHUCHUDIANYARAODONG) JIANXIAO,SHIHEGAOPINYINGYONG,CAOZUOBIJIAOFANGBIAN,KEKAOXINGYEBIJIAOGAO,TONGSHITSOPFENGZHUANGJUYOUJISHUJIANDAN、CHENGPINLVGAO、ZAOJIADILIANDENGYOUDIAN,YINCIDEDAOLEJIWEIGUANGFANDEYINGYONG。

TSOP封测一览表

 

 

产品示意图

 

技术优势

可定制化:


1.可定制化产品厚度;
2.产品封装尺寸;
河内分分彩3.Wire bonding线可选金线,合金线,金包银等;

 

关键工艺及制成能力:


1.超薄型晶圆研磨工艺能力SDBG,最薄可至25um,密集型晶圆切割能力,切割道宽度20um(flash)可稳定切割;
2.成熟稳定Die attach 工艺,可稳定生产25um的IC;
3.稳定的Molding工艺能力,最高可实现30um的Molding Gap,可完美实现TSOP产品的模封;
4.稳定叠Die工艺,对TSOP可实现超薄型叠Die;
5.优异的TSOP小基板设计方案。

我有此类服务需求

河内分分彩QINGJIANYAOMIAOSHUNINXUYAODEFUWULEIXING,WOMENDEFUWUTUANDUIJIANGDIYISHIJIANJINIQUDELIANXI。